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PDTC114EMB,315 - Nexperia

Description: Bipolar Transistors - Pre-Biased TRANS BIPOLAR PB

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PDTC114EMB,315 - Nexperia - PCB symbol
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PCB Footprints
PDTC114EMB,315 - Nexperia PCB footprint - Other - Other - PDTC114EMB,315-2
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3D Models
PDTC114EMB,315 - Nexperia - 3D model - Other - PDTC114EMB,315-2
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PDTC114EMB,315 Details

  • Manufacturer Part Number:

    PDTC114EMB,315

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    DFN1006B-3, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT883B

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Additional Feature:

    BUILT IN BIAS RESISTANCE RATIO IS 1

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    30

  • JESD-30 Code:

    R-PBCC-N3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    230 MHz

PDTC114EMB,315 Frequently Asked Questions (FAQs)

  • Nexperia recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a solid copper plane on the PCB.
  • To ensure reliable operation at high temperatures, it's essential to follow Nexperia's recommended thermal design guidelines, including proper heat sinking, thermal interface material selection, and avoiding thermal hotspots. Additionally, consider derating the device's power handling capabilities at higher temperatures.
  • While the datasheet specifies the maximum rated voltage, it's essential to consider the voltage stress during switching transitions. Nexperia recommends limiting the voltage stress to 1.5 times the maximum rated voltage to ensure reliable operation and prevent damage to the device.
  • To minimize EMI, Nexperia recommends using a layout with a solid ground plane, minimizing track lengths, and using shielding or filtering components. Additionally, consider using a common-mode choke or ferrite beads to reduce EMI emissions.
  • Nexperia recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device and ensure reliable operation.

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PDTC114EMB,315 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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