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PDZ3.0B,115 - Nexperia

Description: Zener Diodes DIODE ZENER 2 PCT

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PCB Footprints
PDZ3.0B,115 - Nexperia PCB footprint - Small Outline Diode - Small Outline Diode - SOD323
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PDZ3.0B,115 - Nexperia  - 3D model - Small Outline Diode - SOD323
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PDZ3.0B,115 Details

  • Manufacturer Part Number:

    PDZ3.0B,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Package Description:

    SC-76, SOD-323, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD323

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    1997-09-08

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    95 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    1000 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.4 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    3 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    -2.1 mV/°C

  • Voltage Tol-Max:

    3.72%

  • Working Test Current:

    5 mA

PDZ3.0B,115 Frequently Asked Questions (FAQs)

  • Store the devices in a dry, dark place at a temperature between 5°C and 30°C, and a relative humidity of 60% or less.
  • Use an ESD wrist strap, mat, or workstation, and ensure all equipment is grounded. Handle devices by the body or leads, avoiding direct contact with the pins.
  • Use a soldering temperature profile with a peak temperature of 245°C, a dwell time of 30-45 seconds, and a cooling rate of 4°C/s or less.
  • Yes, but ensure you follow Nexperia's recommended guidelines for high-reliability applications, including burn-in, screening, and qualification testing.
  • Follow the MSL (Moisture Sensitivity Level) guidelines, and ensure the devices are baked at 125°C for 24 hours before reflow soldering.

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PDZ3.0B,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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