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PDZ5.6BGWJ - Nexperia

Description: NXP Semiconductors PDZ5.6BGW/SOD123/SOD2

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PCB Footprints
PDZ5.6BGWJ - Nexperia PCB footprint - Other - Other - SOD123 _2022
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3D Models
PDZ5.6BGWJ - Nexperia  - 3D model - Other - SOD123 _2022
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PDZ5.6BGWJ Details

  • Manufacturer Part Number:

    PDZ5.6BGWJ

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-123, 2 PIN

  • Manufacturer Package Code:

    SOD123

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    50 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    100 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.365 W

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    5.6 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    1.9 mV/°C

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    5 mA

PDZ5.6BGWJ Frequently Asked Questions (FAQs)

  • Store the devices in a dry, dark place at a temperature between 20°C and 30°C, and a relative humidity of 50% to 60%. Avoid exposure to direct sunlight, moisture, and extreme temperatures.
  • Use an anti-static wrist strap, mat, or workstation to prevent electrostatic discharge. Ensure all equipment and tools are grounded, and handle the devices by the body or leads, not the pins.
  • Follow the standard reflow soldering temperature profile: ramp up to 180°C in 60-90 seconds, peak at 240-250°C for 10-30 seconds, and cool down to 100°C in 60-90 seconds.
  • Yes, PDZ5.6BGWJ is suitable for high-reliability applications. However, ensure you follow Nexperia's recommended guidelines for design, manufacturing, and testing to ensure the device meets your specific reliability requirements.
  • Use a systematic approach: verify the device is properly soldered, check for correct polarity, ensure proper voltage and current ratings, and use a multimeter to measure voltage and current at the device pins.

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PDZ5.6BGWJ Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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