ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the device. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. ROHM also recommends using a thermally conductive adhesive or thermal tape to attach the device to a heat sink or PCB.
ROHM recommends soldering the device using a reflow soldering process with a peak temperature of 260°C (500°F) for 10-30 seconds. The recommended soldering conditions are: preheating at 150-200°C (302-392°F) for 60-90 seconds, followed by a peak temperature of 260°C (500°F) for 10-30 seconds, and then cooling at a rate of 4°C/s (7.2°F/s) or less.
To prevent damage during storage and shipping, ROHM recommends storing the devices in their original packaging or in a similar protective package. The devices should be protected from moisture, dust, and mechanical stress. Avoid bending, flexing, or applying excessive pressure to the leads or package.
ROHM recommends handling the devices by the body or the leads, avoiding touching the pins or the package. Clean the devices using a soft brush or a lint-free wipe with a mild detergent and deionized water. Avoid using ultrasonic cleaning, as it may damage the device.
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PDZVTFTR16B Overview
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