PDZVTFTR2.0B footprint, schematic symbol and 3D model by ROHM Semiconductor

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PCB Footprints

3D Models

PDZVTFTR2.0B Details

A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
Use a heat sink or thermal interface material to reduce thermal resistance. Ensure good airflow and avoid blocking airflow around the device. Follow the recommended operating temperature range (Tj) of -40°C to 150°C.
The maximum allowed voltage on the input pins is 5.5V. Exceeding this voltage may cause damage to the device.
Yes, but ensure that the switching frequency is within the recommended range (up to 1MHz). Exceeding this frequency may cause increased power losses and reduced efficiency.
Use ESD protection devices, such as TVS diodes or ESD arrays, on the input and output lines to protect the device from electrostatic discharge.

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Use the download button to access the PDZVTFTR2.0B schematic symbol, PCB footprint, and 3D model.

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