PE1206FRF470R008L footprint, schematic symbol and 3D model by Yageo Group

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PE1206FRF470R008L Details

The recommended land pattern for PE1206FRF470R008L is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
PE1206FRF470R008L is rated for operation up to 150°C, but it's recommended to derate the component's power rating by 50% when operating above 125°C. Additionally, ensure that the component is properly cooled and that the operating conditions do not exceed the maximum rated temperature.
PE1206FRF470R008L is a moisture-sensitive device (MSD) with a moisture sensitivity level (MSL) of 3. Handle the component according to the JEDEC J-STD-033 standard, which recommends baking the component at 125°C for 24 hours before reflow soldering to prevent moisture-related defects.
The recommended reflow soldering profile for PE1206FRF470R008L is a peak temperature of 260°C, with a dwell time above 220°C of 30-60 seconds. Ensure that the temperature ramp rate is 3°C/second or less to prevent thermal shock.
PE1206FRF470R008L is designed to withstand moderate vibration levels, but it's recommended to ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent component detachment or damage.

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