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PE42520C-Z - Peregrine Semiconductor

Description: RF Switch ICs SPDT, High Iso, High Power, Absorptive, 50? Instrumentation Switch

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PCB Footprints
PE42520C-Z - Peregrine Semiconductor PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16-lead 3x3 mm QFN
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3D Models
PE42520C-Z - Peregrine Semiconductor  - 3D model - Quad Flat No-Lead - 16-lead 3x3 mm QFN
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PE42520C-Z Details

  • Manufacturer Part Number:

    PE42520C-Z

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.50.70.00

  • Date Of Intro:

    2018-12-12

  • Manufacturer:

    pSemi

  • YTEOL:

    8.1

  • Additional Feature:

    HIGH LINEARITY AND ISOLATION

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Input Power-Max (CW):

    36 dBm

  • Insertion Loss-Max:

    2.7 dB

  • Isolation-Min:

    13 dB

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • On Time-Nom:

    5.5 µs

  • Operating Frequency-Max:

    13000 MHz

  • Operating Frequency-Min:

    0.009 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Packing Method:

    TR

  • Port Termination:

    ABSORPTIVE

  • Power Supplies:

    3.3/3.4 V

  • RF/Microwave Device Type:

    SPDT

  • Supply Current-Max:

    0.2 mA

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • VSWR-Max:

    1.15

PE42520C-Z Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation. Use thermal tape or a heat sink for high-power applications.
  • Use the lowest possible supply voltage, enable the power-down mode when not in use, and optimize the output impedance to minimize power loss. Additionally, consider using a lower frequency clock input to reduce power consumption.
  • Use a 50-ohm termination for the input and output signals, and consider using a series resistor and shunt capacitor for impedance matching. Ensure the PCB trace impedance is matched to the device's output impedance.
  • Use a logic analyzer or oscilloscope to monitor the device's input and output signals. Check the power supply voltage, clock input, and output impedance for any anomalies. Consult the datasheet and application notes for troubleshooting guidelines.
  • The device is rated for industrial temperature range (-40°C to 85°C). Ensure proper PCB design, thermal management, and handling to prevent mechanical stress and moisture damage. Follow the recommended storage and handling procedures to maintain device reliability.

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