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PE42823A-X - Peregrine Semiconductor

Description: PE42823 SPDT RF switch

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Symbol
PE42823A-X - Peregrine Semiconductor - PCB symbol
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PCB Footprints
PE42823A-X - Peregrine Semiconductor PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16-lead 3 × 3 ×0.75 mm QFN
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3D Models
PE42823A-X - Peregrine Semiconductor - 3D model - Quad Flat No-Lead - 16-lead 3 × 3 ×0.75 mm QFN
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PE42823A-X Details

  • Manufacturer Part Number:

    PE42823A-X

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.50.70.00

  • Date Of Intro:

    2017-05-26

  • Manufacturer:

    pSemi

  • YTEOL:

    7.1

  • 1dB Compression Point:

    43 dBm

  • Construction:

    COMPONENT

  • Input Power-Max (CW):

    42 dBm

  • Insertion Loss-Max:

    1.8 dB

  • Isolation-Min:

    22 dB

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • On Time-Nom:

    0.84 µs

  • Operating Frequency-Max:

    6000 MHz

  • Operating Frequency-Min:

    700 MHz

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Power Supplies:

    2.5/5 V

  • RF/Microwave Device Type:

    SPDT

  • Supply Current-Max:

    0.2 mA

  • Surface Mount:

    YES

  • Technology:

    UltraCMOS

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • VSWR-Max:

    1.13

PE42823A-X Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Use a pi-network topology with a series inductor and shunt capacitors. Optimize component values using simulation tools or empirical methods to achieve a return loss of < -15 dB.
  • The device is rated for operation from -40°C to 85°C. However, for reliable operation, it's recommended to keep the junction temperature below 125°C to prevent thermal throttling.
  • Use a shielded enclosure, ensure proper grounding, and follow good PCB layout practices. Additionally, consider adding EMI filters or shielding components to minimize radiation.
  • Power up the device in the following sequence: VCC, then VDD, and finally enable the input signal. Ensure a monotonic power-up sequence to prevent latch-up or damage.

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PE42823A-X Overview

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