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PE43704B-Z - Peregrine Semiconductor

Description: Attenuators 50? 7Bit 31.75dB 0.25dB, 0.5dB 1.0dB Digital Step Attenuator, optional ext. Vss

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PCB Footprints
PE43704B-Z - Peregrine Semiconductor PCB footprint - Other - Other - 32-lead 5x5 QFN_2021
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3D Models
PE43704B-Z - Peregrine Semiconductor  - 3D model - Other - 32-lead 5x5 QFN_2021
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PE43704B-Z Details

  • Manufacturer Part Number:

    PE43704B-Z

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-32

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2018-07-18

  • Manufacturer:

    pSemi

  • YTEOL:

    6.6

  • Additional Feature:

    I/P POWER-MAX(PULSE)=1.26W

  • Attenuation-Nom:

    31 dB

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Input Power-Max (CW):

    34 dBm

  • Insertion Loss-Max:

    3.2 dB

  • JESD-609 Code:

    e4

  • Operating Frequency-Max:

    8000 MHz

  • Operating Frequency-Min:

    0.009 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • RF/Microwave Device Type:

    VARIABLE ATTENUATOR

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

PE43704B-Z Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for heat dissipation. Use thermal pads or a heat sink for high-power applications.
  • Use a pi-network or a T-network topology with a series inductor and shunt capacitors to match the input impedance. Optimize component values using simulation tools or measurement-based methods.
  • Ensure a stable voltage supply with minimal ripple. Use a voltage regulator or a low-dropout regulator to maintain a stable bias voltage. Add decoupling capacitors to filter out noise and ensure stability.
  • Use a shielded enclosure, keep sensitive components away from the amplifier, and use EMI filters or absorbers. Ensure proper grounding and decoupling to minimize radiation and susceptibility.
  • Derate the device's power handling by 1.5% per degree Celsius above 85°C. Ensure proper heat sinking and thermal management to maintain a safe junction temperature.

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