PEME2-S24-D3-S - CUI Inc.

PEME2-S24-D3-S Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  CUI recommends a PCB layout with a large copper area underneath the module to dissipate heat effectively. A minimum of 1 oz copper thickness is recommended, and the copper area should be connected to a solid ground plane to reduce thermal resistance.
• How do I ensure reliable soldering of the module?
  CUI recommends using a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. The module should be soldered within 3 seconds to 5 seconds, and the solder joints should be inspected for any signs of cold soldering or overheating.
• What is the maximum allowable voltage deviation for the input voltage?
  The PEME2-S24-D3-S can tolerate an input voltage deviation of ±10% of the nominal input voltage. Exceeding this deviation may affect the module's performance, efficiency, or reliability.
• How do I protect the module from overcurrent and overvoltage conditions?
  CUI recommends using external overcurrent protection (OCP) and overvoltage protection (OVP) circuits to prevent damage to the module. The OCP should be set to 1.5 times the maximum rated output current, and the OVP should be set to 1.1 times the maximum rated output voltage.
• What is the typical efficiency of the PEME2-S24-D3-S?
  The typical efficiency of the PEME2-S24-D3-S is around 85% to 90% at full load, depending on the input voltage and operating temperature. The efficiency may vary depending on the specific application and operating conditions.