PEME2-S5-D15-S - CUI Inc.

PEME2-S5-D15-S Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  CUI recommends a PCB layout with a large copper area underneath the module to dissipate heat effectively. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a solid ground plane to reduce thermal resistance.
• How do I ensure reliable soldering of the module?
  CUI recommends using a soldering iron with a temperature range of 250°C to 260°C and a solder with a melting point of 180°C to 190°C. Apply a small amount of solder paste to the PCB pads and use a gentle soldering technique to avoid damaging the module.
• What is the maximum allowable voltage deviation for the input voltage?
  CUI recommends keeping the input voltage deviation within ±10% of the nominal input voltage to ensure reliable operation and to prevent damage to the module.
• How do I protect the module from overvoltage and overcurrent conditions?
  CUI recommends using external overvoltage protection (OVP) and overcurrent protection (OCP) circuits to prevent damage to the module. The OVP circuit should be set to trigger at 1.5 times the nominal input voltage, and the OCP circuit should be set to trigger at 1.5 times the nominal output current.
• What is the recommended input capacitor value and type?
  CUI recommends using a low-ESR ceramic capacitor with a value of 10 μF to 22 μF and a voltage rating of 25 V or higher. The capacitor should be placed as close as possible to the input pins of the module to reduce noise and ripple.