PESE1-S5-D5-M-TR - CUI Inc.

PESE1-S5-D5-M-TR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout and thermal management for optimal performance?
  CUI recommends a PCB layout with a solid ground plane and thermal vias to dissipate heat. A minimum of 1 oz copper thickness is recommended. Additionally, a thermal interface material (TIM) can be used to improve heat transfer between the module and the heat sink.
• How do I ensure the module is properly soldered and what are the recommended soldering conditions?
  CUI recommends using a soldering iron with a temperature range of 250°C to 260°C. The module should be soldered using a no-clean flux and a solder with a melting point of 217°C to 220°C. A soldering time of 3-5 seconds per pin is recommended.
• What are the electrical isolation and creepage distances between the input and output?
  The PESE1-S5-D5-M-TR has a minimum electrical isolation of 1500 Vrms and a creepage distance of 4.5 mm between the input and output. This ensures safe and reliable operation in accordance with UL and IEC standards.
• Can I use this module in a high-vibration or high-shock environment?
  Yes, the PESE1-S5-D5-M-TR is designed to withstand high-vibration and high-shock environments. It has been tested to meet the requirements of IEC 60068-2-6 (vibration) and IEC 60068-2-27 (shock). However, it's recommended to consult with CUI's application engineers to ensure the module meets the specific requirements of your application.
• What is the MTBF (Mean Time Between Failures) of this module?
  The MTBF of the PESE1-S5-D5-M-TR is calculated to be >1 million hours at 25°C ambient temperature, based on MIL-HDBK-217F calculations. This indicates a high level of reliability and long-term performance.