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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for PH2625L,115
- Part Number PH2625L,115
- Manufacturer Nexperia
- Pin Count 5
- Last Modified Date Jun 22, 2022 9:39 PM UTC
- Pinout / Pin List Click Here (Member Only)
PH2625L,115 Details
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Manufacturer Part Number:
PH2625L,115
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Brand Name:
Nexperia
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Rohs Code:
Yes
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Part Life Cycle Code:
Obsolete
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Part Package Code:
SOIC
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Package Description:
LFPAK-4
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Pin Count:
4
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Manufacturer Package Code:
SOT669
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Country Of Origin:
Philippines
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ECCN Code:
EAR99
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Manufacturer:
Nexperia
PH2625L,115 Frequently Asked Questions (FAQs)
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A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer. This helps to dissipate heat efficiently. Additionally, it's recommended to have a minimum of 2 oz copper thickness and a thermal via array under the IC to further improve thermal performance.
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To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using a heat sink or a thermal interface material to improve heat dissipation. It's also crucial to ensure good airflow and avoid any thermal hotspots in the system.
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For ESD protection, it's recommended to use a TVS (Transient Voltage Suppressor) diode or a dedicated ESD protection IC at the input lines. Additionally, follow proper PCB design guidelines for ESD protection, such as using a ground plane, minimizing trace lengths, and avoiding sharp corners.
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Yes, the PH2625L,115 is AEC-Q100 qualified, making it suitable for automotive and high-reliability applications. However, it's essential to follow the recommended operating conditions, and ensure that the device is used within the specified temperature range and other recommended operating conditions.
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For soldering and rework, follow the recommended temperature profiles and guidelines provided in the datasheet. It's essential to use a soldering iron with a temperature range of 350°C to 370°C, and to avoid overheating the device. Additionally, use a solder with a melting point above 217°C to ensure reliable joints.
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PH2625L,115 Overview
Use the download button to access the PH2625L,115 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like PH262,
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About Nexperia
Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.
