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PHPT60603PYX - Nexperia

Description: Transistor PNP 60V 3A Auto LFPAK56

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PCB Footprints
PHPT60603PYX - Nexperia PCB footprint - Other - Other -  LFPAK56; Power-SO8 (SOT669)
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3D Models
PHPT60603PYX - Nexperia  - 3D model - Other -  LFPAK56; Power-SO8 (SOT669)
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PHPT60603PYX Details

  • Manufacturer Part Number:

    PHPT60603PYX

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOT-669, SOP-8, 4 PIN

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT669

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    4

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    3 A

  • Collector-Base Capacitance-Max:

    60 pF

  • Collector-Emitter Voltage-Max:

    60 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    150

  • JEDEC-95 Code:

    MO-235

  • JESD-30 Code:

    R-PSSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    25 W

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    110 MHz

  • VCEsat-Max:

    0.36 V

PHPT60603PYX Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane and a thermal relief pattern under the device. This helps to dissipate heat efficiently and reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal design and layout guidelines, and to consider derating the device's power handling capabilities according to the ambient temperature.
  • The PHPT60603PYX has built-in ESD protection, but it is still recommended to follow proper ESD handling and storage procedures to prevent damage. Additionally, latch-up prevention can be achieved by following proper PCB design and layout guidelines, and by ensuring that the device is operated within its recommended operating conditions.
  • To troubleshoot and debug issues with the PHPT60603PYX, it is recommended to use a systematic approach, starting with a review of the device's datasheet and application notes. Next, verify the PCB layout and design, and then use diagnostic tools such as oscilloscopes and logic analyzers to identify the root cause of the issue.
  • To prevent damage and ensure reliability, it is recommended to store the PHPT60603PYX in a dry, cool place, away from direct sunlight and moisture. Handling should be done with proper ESD protection, and the device should be soldered using a controlled soldering process.

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PHPT60603PYX Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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