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PI3CH480LE - Diodes Incorporated

Description: Multiplexer Switch ICs Lo Vltg Hi Bandwidth

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PI3CH480LE - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - 16-Pin TSSOP (L)
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PI3CH480LE - Diodes Incorporated  - 3D model - Small Outline Packages - 16-Pin TSSOP (L)
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PI3CH480LE Details

  • Manufacturer Part Number:

    PI3CH480LE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    0.173 INCH, GREEN, PLASTIC, TSSOP-16

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 3.3V SUPPLY

  • Family:

    3CH

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Logic IC Type:

    BUS EXCHANGER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Inputs:

    2

  • Number of Outputs:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    0.3 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    2.75 V

  • Supply Voltage-Min (Vsup):

    2.25 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

PI3CH480LE Frequently Asked Questions (FAQs)

  • A good PCB layout practice for the PI3CH480LE is to keep the signal traces short and away from noise sources, use a solid ground plane, and add decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure reliable operation of the PI3CH480LE in high-temperature environments, it is recommended to follow proper thermal design guidelines, such as providing adequate heat sinking, using thermal interface materials, and keeping the device within its recommended operating temperature range.
  • The PI3CH480LE has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. Additionally, it is recommended to use ESD protection devices on the input/output lines to protect the device from external ESD events.
  • To troubleshoot issues with the PI3CH480LE, it is recommended to use oscilloscopes and logic analyzers to capture signal waveforms and protocol data. Additionally, checking the device's power supply, clock signals, and signal termination can help identify the root cause of the issue.
  • The recommended power sequencing for the PI3CH480LE is to power up the device in the following order: VCC, VCCIO, and then the clock signal. A reset strategy involving a power-on reset and a clock reset is recommended to ensure proper device initialization.

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PI3CH480LE Overview

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