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PI3WVR646GEEX - Diodes Incorporated

Description: Telecommunications Switch IC 10 Channel 36-CSP (2.44x2.44)

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PCB Footprints
PI3WVR646GEEX - Diodes Incorporated PCB footprint - Other - Other - PI3WVR646GEEX-2
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PI3WVR646GEEX - Diodes Incorporated  - 3D model - Other - PI3WVR646GEEX-2
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PI3WVR646GEEX Details

  • Manufacturer Part Number:

    PI3WVR646GEEX

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    UWLB-36

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    S-XBGA-B36

  • Length:

    2.44 mm

  • Number of Channels:

    1

  • Number of Functions:

    10

  • Number of Terminals:

    36

  • Off-state Isolation-Nom:

    26 dB

  • On-state Resistance Match-Nom:

    0.1 Ω

  • On-state Resistance-Max (Ron):

    9 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA36,6X6,14

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.54 mm

  • Supply Voltage-Max (Vsup):

    5 V

  • Supply Voltage-Min (Vsup):

    1.5 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    800 ns

  • Switch-on Time-Max:

    1100 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Width:

    2.44 mm

PI3WVR646GEEX Frequently Asked Questions (FAQs)

  • A good PCB layout for the PI3WVR646GEEX involves keeping the input and output tracks as short as possible, using a solid ground plane, and minimizing the distance between the device and the load. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliability in high-temperature applications, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and ensure good airflow around the device. Additionally, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • The PI3WVR646GEEX has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded.
  • Yes, the PI3WVR646GEEX can be used in a redundant or parallel configuration to increase the current output. However, it's essential to ensure that the devices are properly synchronized and that the output tracks are properly connected to avoid any potential issues.
  • The PI3WVR646GEEX has a thermal derating curve that should be followed to ensure reliable operation. The device's power rating decreases as the ambient temperature increases, so it's essential to consider the operating temperature and adjust the power rating accordingly.

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PI3WVR646GEEX Overview

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