Diodes Incorporated recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, a thermal pad on the bottom of the device should be connected to a thermal plane or a heat sink.
To ensure signal integrity, use controlled impedance traces (85 ohms for PCIe lanes), and keep the traces as short as possible. Use a common mode filter or a PCIe repeater if the traces are longer than 12 inches. Also, use a high-quality PCB material with low dielectric loss.
The PI6PCIEB24ZDEX is rated for industrial temperature range, which is -40°C to 85°C. However, the device can operate up to 100°C with derating. Consult the datasheet for derating curves and thermal management guidelines.
Yes, the PI6PCIEB24ZDEX can be used in a PCIe Gen3 application, but it is limited to 5 GT/s (Gen2) speed due to its architecture. For Gen3 speeds (8 GT/s), a different device or a PCIe redriver/repeater is required.
The PI6PCIEB24ZDEX requires a specific power sequencing to ensure proper operation. The VCCIO and VCC pins should be powered up simultaneously, followed by the VREF pin. The power sequencing should be within 100 ms. Consult the datasheet for detailed power-up and power-down sequencing requirements.
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