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PI7C9X1170CZDEX - Diodes Incorporated

Description: Diodes Inc. SPI Bridge V-QFN4040-24 T&R 3.5K

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PI7C9X1170CZDEX - Diodes Incorporated PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 24-Contact QFN (ZD)
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PI7C9X1170CZDEX - Diodes Incorporated  - 3D model - Quad Flat No-Lead - 24-Contact QFN (ZD)
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PI7C9X1170CZDEX Details

  • Manufacturer Part Number:

    PI7C9X1170CZDEX

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TQFN-24

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-11-13

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Additional Feature:

    ALSO OPERATES AT 1.8V AND 2.5V NOMINAL

  • Boundary Scan:

    NO

  • Bus Compatibility:

    I2C; IRDA; RS-232; RS-485; SPI

  • Clock Frequency-Max:

    64 MHz

  • Communication Protocol:

    ASYNC, BIT; SYNC, BYTE

  • Data Transfer Rate-Max:

    4.125 MBps

  • JESD-30 Code:

    S-XQCC-N24

  • Length:

    4 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    255

  • Seated Height-Max:

    0.9 mm

  • Supply Current-Max:

    6 mA

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS

PI7C9X1170CZDEX Frequently Asked Questions (FAQs)

  • Diodes Incorporated recommends a 4-layer PCB with a solid ground plane, and to keep the signal traces as short as possible to minimize signal reflections and crosstalk. Additionally, it's recommended to use a 50Ω impedance-controlled trace for the clock signal.
  • The PI7C9X1170CZDEX has a thermal pad on the bottom of the package, which should be connected to a solid ground plane on the PCB to dissipate heat. Additionally, it's recommended to use a thermal interface material (TIM) between the thermal pad and the PCB to improve heat transfer.
  • The maximum operating frequency of PI7C9X1170CZDEX is 100 MHz, but it can be overclocked up to 150 MHz with proper PCB design and signal integrity considerations.
  • The output drive strength of PI7C9X1170CZDEX can be configured through the I2C interface by writing to the Output Drive Strength Register (ODSR). The ODSR allows the user to select from four different drive strengths: 4mA, 8mA, 12mA, and 16mA.
  • The power consumption of PI7C9X1170CZDEX depends on the operating frequency and output drive strength. At 100 MHz and 4mA output drive strength, the typical power consumption is around 150 mW. However, this can increase to up to 300 mW at 150 MHz and 16mA output drive strength.

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PI7C9X1170CZDEX Overview

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