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PIC12LF1840T-I/RF - Microchip

Description: 8-bit Microcontrollers - MCU 8-BIT MCU 7KB Fl 256B RAM

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PCB Footprints
PIC12LF1840T-I/RF - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (RF) - 3x3x0.50 mm Body
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3D Models
PIC12LF1840T-I/RF - Microchip  - 3D model - Small Outline No-lead - 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (RF) - 3x3x0.50 mm Body
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PIC12LF1840T-I/RF Details

  • Manufacturer Part Number:

    PIC12LF1840T-I/RF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    UDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    UDFN-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    4.5

  • Has ADC:

    YES

  • Additional Feature:

    OPERATES AT 1.8 V MINIMUM SUPPLY AT 16 MHZ

  • Bit Size:

    8

  • Boundary Scan:

    NO

  • CPU Family:

    PIC12

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of External Interrupts:

    1

  • Number of I/O Lines:

    6

  • Number of Serial I/Os:

    8

  • Number of Terminals:

    8

  • Number of Timers:

    6

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    256

  • RAM (words):

    256

  • ROM (words):

    4096

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.55 mm

  • Speed:

    32 MHz

  • Supply Current-Max:

    4 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC12LF1840T-I/RF Frequently Asked Questions (FAQs)

  • The recommended oscillator crystal frequency for PIC12LF1840T-I/RF is between 31 kHz and 8 MHz, with a typical value of 4 MHz or 8 MHz.
  • The internal oscillator can be configured using the OSCTUNE register (OSCTUNE<4:0>) to adjust the frequency. The datasheet provides a table to select the correct values for the desired frequency.
  • The maximum current that can be sourced by an I/O pin is 25 mA, and the maximum current that can be sunk is 25 mA. However, the total current sourced or sunk by all I/O pins should not exceed 200 mA.
  • The PIC12LF1840T-I/RF has several low-power modes, including Sleep, Idle, and Doze. These modes can be entered using the SLEEP instruction or by setting the appropriate bits in the OSCCON register. The datasheet provides more information on how to implement these modes.
  • The minimum operating voltage for PIC12LF1840T-I/RF is 2.0V, and the maximum operating voltage is 3.6V.

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PIC12LF1840T-I/RF Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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