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PIC16F1782-I/MV - Microchip

Description: Microchip PIC16F1782-I/MV, 8bit PIC Microcontroller, 32MHz, 256 B, 2048 words EEPROM, Flash, 28-Pin UQFN

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PIC16F1782-I/MV - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - MV 4X4X0.5 UQFN 28 LEAD PUTQFN
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PIC16F1782-I/MV - Microchip  - 3D model - Quad Flat No-Lead - MV 4X4X0.5 UQFN 28 LEAD PUTQFN
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PIC16F1782-I/MV Details

  • Manufacturer Part Number:

    PIC16F1782-I/MV

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    4 X 4 MM, 0.50 MM HEIGHT, LEAD FREE, PLASTIC, UQFN-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    UQFN-28

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Has ADC:

    YES

  • Additional Feature:

    OPERATES AT 2.3 V MINIMUM SUPPLY AT 16 MHZ

  • Bit Size:

    8

  • Boundary Scan:

    NO

  • CPU Family:

    PIC16

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQCC-N28

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of External Interrupts:

    1

  • Number of I/O Lines:

    25

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    28

  • Number of Timers:

    5

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.16SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    256

  • ROM (words):

    3584

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.55 mm

  • Speed:

    32 MHz

  • Supply Current-Max:

    7.5 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC16F1782-I/MV Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the PIC16F1782 is 32 MHz, but it can be overclocked to 40 MHz with some limitations.
  • The internal oscillator of the PIC16F1782 can be configured using the OSCCON register. The oscillator frequency can be set to 31 kHz, 125 kHz, 250 kHz, 500 kHz, 1 MHz, 2 MHz, 4 MHz, or 8 MHz.
  • The maximum current that can be sourced or sunk by the I/O pins of the PIC16F1782 is 25 mA per pin, with a total current limit of 200 mA for all I/O pins combined.
  • The ADC module of the PIC16F1782 can be used by configuring the ADCON0 and ADCON1 registers. The ADC can be set to operate in 8-bit or 10-bit mode, and can be triggered by a software command or an external clock signal.
  • The PLL module in the PIC16F1782 is used to multiply the internal oscillator frequency by 4, allowing the microcontroller to operate at higher frequencies while maintaining a stable clock signal.

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PIC16F1782-I/MV Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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