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PIC16F1787-I/P - Microchip

Description: Microchip PIC16F1787-I/P, 8bit PIC Microcontroller, 32MHz, 8192 words Flash, 40-Pin PDIP

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PIC16F1787-I/P - Microchip PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 40 ld PDIP (P) 600 mil
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PIC16F1787-I/P - Microchip  - 3D model - Dual-In-Line Packages - 40 ld PDIP (P) 600 mil
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PIC16F1787-I/P Details

  • Manufacturer Part Number:

    PIC16F1787-I/P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PDIP-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    PDIP-40

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Has ADC:

    YES

  • Additional Feature:

    OPERATES AT 2.3 V MINIMUM SUPPLY AT 16 MHz

  • Bit Size:

    8

  • Boundary Scan:

    NO

  • CPU Family:

    PIC16

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PDIP-T40

  • JESD-609 Code:

    e3

  • Length:

    50.8 mm

  • Low Power Mode:

    YES

  • Number of External Interrupts:

    1

  • Number of I/O Lines:

    36

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    40

  • Number of Timers:

    5

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP40,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    1024

  • RAM (words):

    1024

  • ROM (words):

    14336

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    6.35 mm

  • Speed:

    32 MHz

  • Supply Current-Max:

    7.5 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    15.24 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC16F1787-I/P Frequently Asked Questions (FAQs)

  • The PIC16F1787 can operate at a maximum clock frequency of 32 MHz, but it's recommended to use a clock frequency of 16 MHz or lower for most applications to ensure reliable operation.
  • The internal oscillator on the PIC16F1787 can be configured using the OSCCON register. The oscillator frequency can be set to 31 kHz, 125 kHz, 250 kHz, 500 kHz, 1 MHz, 2 MHz, 4 MHz, or 8 MHz by setting the appropriate bits in the OSCCON register.
  • The PIC16F1787 can source or sink up to 25 mA of current on its I/O pins, but it's recommended to limit the current to 10 mA or less to ensure reliable operation and prevent overheating.
  • The ADC on the PIC16F1787 can be used by configuring the ADCON0 and ADCON1 registers. The ADC can be set to operate in 8-bit or 10-bit mode, and the reference voltage can be set to VDD, VSS, or an external reference voltage.
  • The BOR feature on the PIC16F1787 is used to reset the microcontroller when the supply voltage falls below a certain threshold (typically around 2.5V). This helps to prevent the microcontroller from operating erratically or unpredictably during power-on or power-down sequences.

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PIC16F1787-I/P Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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