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PIC16F54-E/P - Microchip

Description: IC MCU 8BIT 768B FLASH 18DIP

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PIC16F54-E/P - Microchip PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 18-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
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PIC16F54-E/P - Microchip  - 3D model - Dual-In-Line Packages - 18-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
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PIC16F54-E/P Details

  • Manufacturer Part Number:

    PIC16F54-E/P

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    0.300 INCH, PLASTIC, MS-001, DIP-18

  • Pin Count:

    18

  • Manufacturer Package Code:

    PDIP-18

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Has ADC:

    NO

  • Additional Feature:

    OPERATES AT 2 V MINIMUM SUPPLY @ 4 MHZ

  • Bit Size:

    8

  • Boundary Scan:

    NO

  • CPU Family:

    PIC16

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PDIP-T18

  • JESD-609 Code:

    e3

  • Length:

    22.86 mm

  • Low Power Mode:

    YES

  • Number of I/O Lines:

    12

  • Number of Terminals:

    18

  • Number of Timers:

    2

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP18,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    25

  • ROM (words):

    768

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    4.32 mm

  • Speed:

    20 MHz

  • Supply Current-Max:

    7 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC16F54-E/P Frequently Asked Questions (FAQs)

  • The PIC16F54-E/P can operate at a maximum clock frequency of 20 MHz, but it's recommended to operate it at 4 MHz or lower for optimal performance and to ensure that the device meets its specifications.
  • The oscillator mode on the PIC16F54-E/P can be configured using the FOSC2:FOSC0 bits in the CONFIG register. The device can be configured to use an internal RC oscillator, an external crystal oscillator, or an external RC oscillator.
  • The MCLR (Master Clear) pin on the PIC16F54-E/P is an active-low reset input that can be used to reset the device. It can also be used as a programming voltage input during device programming.
  • The PIC16F54-E/P has a single interrupt vector that can be used to handle interrupts from various sources such as timer overflow, external interrupts, and UART interrupts. The interrupt sources can be enabled and prioritized using the INTCON and PIE registers.
  • The PIC16F54-E/P can source or sink up to 25 mA of current on its I/O pins, but it's recommended to limit the current to 10 mA or less to ensure that the device meets its specifications and to prevent overheating.

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PIC16F54-E/P Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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