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PIC16LF1709-I/SO - Microchip

Description: Microchip PIC16LF1709-I/SO, 8bit PIC Microcontroller, 32MHz, 8192 words Flash, 20-Pin SOIC

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PIC16LF1709-I/SO - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 20-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body [SOIC]
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PIC16LF1709-I/SO - Microchip  - 3D model - Small Outline Packages - 20-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body [SOIC]
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PIC16LF1709-I/SO Details

  • Manufacturer Part Number:

    PIC16LF1709-I/SO

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    SOIC-20

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Has ADC:

    YES

  • Additional Feature:

    OPERATES AT 1.8 V MINIMUM SUPPLY AT 16 MHZ

  • Bit Size:

    8

  • Boundary Scan:

    NO

  • CPU Family:

    PIC16

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of External Interrupts:

    1

  • Number of I/O Lines:

    18

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    20

  • Number of Timers:

    5

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • RAM (bytes):

    1024

  • ROM (words):

    8192

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    2.65 mm

  • Speed:

    32 MHz

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    7.5 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC16LF1709-I/SO Frequently Asked Questions (FAQs)

  • The maximum clock frequency that can be used with the internal oscillator is 32 MHz, but it's recommended to use a clock frequency of 16 MHz or less to ensure reliable operation.
  • The BOR voltage can be configured using the BORV and BORW bits in the Configuration Word (CONFIG) register. The BOR voltage can be set to 2.7V, 2.2V, or 1.9V, depending on the application requirements.
  • Yes, the PIC16LF1709-I/SO is a 5V-tolerant device, meaning it can operate with a VDD voltage of up to 5.5V. However, the recommended operating voltage is 2.5V to 3.6V for optimal performance and power consumption.
  • The WDT can be enabled and configured using the WDTCON register. The WDT timeout period can be set to 2.3 ms, 18.3 ms, or 147.4 ms, depending on the application requirements. The WDT can be cleared using the CLRWDT instruction or by resetting the device.
  • The maximum current that can be sourced or sunk by the I/O pins is 25 mA per pin, with a total current limit of 200 mA for all I/O pins combined.

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PIC16LF1709-I/SO Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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