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PIC18F24K42-I/SP - Microchip

Description: Microchip PIC18F24K42-I/SP, 8bit 8 bit CPU Microcontroller, 64MHz, 16 kB Flash, 28-Pin SPDIP

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PIC18F24K42-I/SP - Microchip PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 28-Lead Skinny Plastic Dual In-Line (SP) - 300mil Body [SPDIP]
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3D Models
PIC18F24K42-I/SP - Microchip  - 3D model - Dual-In-Line Packages - 28-Lead Skinny Plastic Dual In-Line (SP) - 300mil Body [SPDIP]
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PIC18F24K42-I/SP Details

  • Manufacturer Part Number:

    PIC18F24K42-I/SP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DIP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    SPDIP-28

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.15

  • Factory Lead Time:

    6 Weeks

  • Date Of Intro:

    2017-02-03

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES 2.5 V MINIMUM SUPPLY AT 32 MHZ AND 2.3 V MINIMUM SUPPLY AT 16 MHZ

  • Bit Size:

    8

  • Boundary Scan:

    NO

  • CPU Family:

    PIC18

  • Clock Frequency-Max:

    64 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PDIP-T28

  • JESD-609 Code:

    e3

  • Length:

    34.671 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    2

  • Number of External Interrupts:

    3

  • Number of I/O Lines:

    25

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    28

  • Number of Timers:

    10

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • RAM (bytes):

    1024

  • ROM (words):

    16384

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    5.08 mm

  • Speed:

    64 MHz

  • Supply Current-Max:

    0.95 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC18F24K42-I/SP Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the PIC18F24K42-I/SP is 64 MHz, but it can be overclocked to 80 MHz with a reduced operating voltage.
  • The oscillator configuration is done using the FOSC2:FOSC0 bits in the CONFIG1H register. The oscillator can be configured for internal, external, or crystal operation.
  • The maximum current that can be sourced or sunk by the I/O pins of the PIC18F24K42-I/SP is 25 mA per pin, with a total current limit of 200 mA for all I/O pins combined.
  • The internal oscillator of the PIC18F24K42-I/SP can be enabled by setting the INTOSC bit in the OSCCON register. The oscillator frequency can be selected using the IRCF bits in the OSCCON register.
  • The power consumption of the PIC18F24K42-I/SP in sleep mode is typically around 0.1 μA, but this can vary depending on the specific sleep mode and the state of the peripherals.

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PIC18F24K42-I/SP Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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