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PIC18LF2221-I/ML - Microchip

Description: Run: CPU On, Peripherals On • Idle: CPU Off, Peripherals On • Sleep: CPU Off, Peripherals Off • Idle mode Currents Down to 2.5 μA Typical • Sleep mode Currents Down to 500 nA Typical • Timer1 Oscillator: 1.8 μA, 32 kHz, 2V Typical • Watchdog Timer: 1.6 μA, 2V Typical • Two-Speed Oscillator Start-up

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PIC18LF2221-I/ML - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN] with 0.55 mm Terminal Length
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3D Models
PIC18LF2221-I/ML - Microchip  - 3D model - Quad Flat No-Lead - 28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN] with 0.55 mm Terminal Length
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PIC18LF2221-I/ML Details

  • Manufacturer Part Number:

    PIC18LF2221-I/ML

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    6 X 6 MM, LEAD FREE, PLASTIC, QFN-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    VQFN-28

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES AT 2V MINIMUM SUPPLY AT 4 MHZ

  • Bit Size:

    8

  • Boundary Scan:

    NO

  • CPU Family:

    PIC18

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQCC-N28

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of External Interrupts:

    3

  • Number of I/O Lines:

    25

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    28

  • Number of Timers:

    6

  • On Chip Program ROM Width:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.24SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    512

  • ROM (words):

    2048

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Speed:

    40 MHz

  • Supply Current-Max:

    23 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    6 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC18LF2221-I/ML Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the PIC18LF2221-I/ML is 40 MHz.
  • No, the PIC18LF2221-I/ML is a low-voltage device and is not recommended for use in 5V systems. It is designed to operate at 2.0V to 3.6V.
  • The PIC18LF2221-I/ML has 22 KB of flash memory.
  • Yes, the PIC18LF2221-I/ML can be used with an external crystal oscillator. The device has an internal oscillator, but it can also be driven by an external clock source.
  • The current consumption of the PIC18LF2221-I/ML in sleep mode is typically around 20 nA.

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PIC18LF2221-I/ML Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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