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PIC32MX174F256DT-V/PT - Microchip

Description: 32-bit Microcontrollers - MCU 32 Bit MCU, 256KB Flash, 64KB RAM, 44 Pin, 3 Comp, CTMU, RTCC

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PIC32MX174F256DT-V/PT - Microchip - PCB symbol
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PCB Footprints
PIC32MX174F256DT-V/PT - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - 44-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP]
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3D Models
PIC32MX174F256DT-V/PT - Microchip - 3D model - Quad Flat Packages - 44-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP]
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PIC32MX174F256DT-V/PT Details

  • Manufacturer Part Number:

    PIC32MX174F256DT-V/PT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    44

  • Manufacturer Package Code:

    TQFP-44

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Has ADC:

    YES

  • Additional Feature:

    12 KB BOOT FLASH MEMORY AVAILABLE

  • Bit Size:

    32

  • CPU Family:

    PIC32

  • Clock Frequency-Max:

    50 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PQFP-G44

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Number of I/O Lines:

    35

  • Number of Terminals:

    44

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TQFP

  • Package Equivalence Code:

    TQFP44,.39SQ,31

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100; TS 16949

  • Seated Height-Max:

    1.2 mm

  • Speed:

    72 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC32MX174F256DT-V/PT Frequently Asked Questions (FAQs)

  • The maximum clock frequency that can be achieved with an external crystal oscillator is 50 MHz. However, the device can also be overclocked up to 80 MHz with a high-speed crystal oscillator, but this is not recommended for production designs.
  • To configure the USB module to work in device mode, you need to set the UMODE register to 0x00, enable the USB module by setting the UEN register to 0x01, and configure the USB address by writing to the UADDR register. You also need to implement the necessary USB device firmware to handle USB requests and responses.
  • Yes, the PIC32MX174F256DT-V/PT can operate with a 3.3V power supply. The device has a wide operating voltage range of 2.3V to 3.6V, making it suitable for use with 3.3V systems.
  • To implement a bootloader on the PIC32MX174F256DT-V/PT, you need to reserve a section of flash memory for the bootloader code, configure the device to boot from that section, and implement the necessary firmware to handle bootloader operations such as firmware updates and device configuration.
  • Yes, the PIC32MX174F256DT-V/PT has an external bus interface that allows it to access external SRAM. You can connect an external SRAM chip to the device's external bus pins and configure the device to use the external SRAM as an extension of its internal memory.

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PIC32MX174F256DT-V/PT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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