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PIC32MX220F032B-I/ML - Microchip

Description: Microchip PIC32MX220F032B-I/ML, 32bit PIC Microcontroller, 40MHz, 35 kB Flash, 28-pin QFN

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PIC32MX220F032B-I/ML - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - (ML) 28-Lead 6x6mm [QFN]
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PIC32MX220F032B-I/ML - Microchip  - 3D model - Quad Flat No-Lead - (ML) 28-Lead 6x6mm [QFN]
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PIC32MX220F032B-I/ML Details

  • Manufacturer Part Number:

    PIC32MX220F032B-I/ML

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    6 X 6 MM, 0.90 MM HEIGHT, 0.65 MM PITCH, LEAD FREE, PLASTIC, QFN-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    VQFN-28

  • Country Of Origin:

    Thailand

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    PIC32

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQCC-N28

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of DMA Channels:

    6

  • Number of External Interrupts:

    5

  • Number of I/O Lines:

    19

  • Number of Terminals:

    28

  • Number of Timers:

    5

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.24SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    8192

  • RAM (words):

    8192

  • ROM (words):

    32768

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Speed:

    40 MHz

  • Supply Current-Max:

    37 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    6 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC32MX220F032B-I/ML Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the PIC32MX220F032B-I/ML is 50 MHz, but it can be overclocked to 72 MHz with a reduced operating voltage.
  • The oscillator can be configured using the FOSCSEL and POSCMD bits in the FOSC register. The oscillator can be set to use an external crystal, internal FRC oscillator, or external clock source.
  • The PIC32MX220F032B-I/ML has 8 KB of RAM, but only 6 KB is available for user applications, as 2 KB is reserved for the stack and other system uses.
  • Yes, the PIC32MX220F032B-I/ML can operate from a 2.3V to 3.6V power supply, making it suitable for use with a 3.3V power supply.
  • The PIC32MX220F032B-I/ML can be programmed using the MPLAB X IDE and a programmer/debugger such as the PICkit 3 or ICD 3. The device can also be programmed using a bootloader or other third-party programming tools.

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PIC32MX220F032B-I/ML Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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