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PL133-27GI-R - Microchip

Description: • Two LVCMOS Outputs • Input/Output Frequency: 1 MHz to 150 MHz • Supports LVCMOS or Sine-Wave Input Clock • Extremely Low Additive Jitter • 8 mA Output Drive Strength • Low Current Consumption • Single 1.8V, 2.5V, or 3.3V ±10% Power Supply • Operating Temperature Range: - 0° to +70°C (Commercial) - –40° to +85°C (Industrial) • Available in TDFN-6L Green/RoHS-Compliant

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PL133-27GI-R - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - PL133-27GC-R-1
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PL133-27GI-R - Microchip  - 3D model - Small Outline No-lead - PL133-27GC-R-1
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PL133-27GI-R Details

  • Manufacturer Part Number:

    PL133-27GI-R

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    6

  • Manufacturer Package Code:

    UDFN-6

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Family:

    PL133

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.08,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Same Edge Skew-Max (tskwd):

    0.5 ns

  • Seated Height-Max:

    0.6 mm

  • Supply Voltage-Max (Vsup):

    3.63 V

  • Supply Voltage-Min (Vsup):

    1.62 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Width:

    1.3 mm

PL133-27GI-R Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Use a reliable communication protocol like SPI or I2C, and ensure proper signal termination and impedance matching. Also, implement error detection and correction mechanisms to handle data transmission errors.
  • The device has a maximum junction temperature of 150°C. Ensure good airflow, use a heat sink if necessary, and avoid blocking the airflow around the device. Also, follow the recommended PCB layout and thermal design guidelines.
  • Follow the recommended power-up and power-down sequencing in the datasheet. Use a low-dropout regulator (LDO) or a switching regulator to ensure a stable and regulated power supply to the device.
  • Follow proper ESD handling and storage procedures. Use ESD-protective packaging and handling equipment. Implement ESD protection circuits and devices in the system design to prevent damage from electrostatic discharge.

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PL133-27GI-R Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image PL133-27GC Microchip Technology Inc

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