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PLI1209BC1101 - VICOR

Description: PLI BCM PMBUS PVOUT LDO Digital Supervisor with Isolation for use with BCM® Bus Converter Modules

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PLI1209BC1101 - VICOR PCB footprint - Other - Other - PLI1209BC1101
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PLI1209BC1101 - VICOR  - 3D model - Other - PLI1209BC1101
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PLI1209BC1101 Details

  • Manufacturer Part Number:

    PLI1209BC1101

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    28 Weeks

  • Manufacturer:

    Vicor Corporation

PLI1209BC1101 Frequently Asked Questions (FAQs)

  • Vicor recommends a 4-layer PCB with a solid ground plane, and a thermal pad connected to a heat sink or a thermal interface material. A minimum of 2 oz copper thickness is recommended for the top and bottom layers. Additionally, a thermal management strategy such as heat sinks, thermal interfaces, or forced air cooling may be necessary to maintain the device's junction temperature within the recommended operating range.
  • The input voltage should be regulated to ensure it stays within the recommended range of 10.2V to 13.2V. A voltage regulator or a DC-DC converter can be used to regulate the input voltage. Additionally, input voltage filtering and decoupling capacitors should be used to minimize noise and ripple.
  • The maximum output current derating for high ambient temperatures can be calculated using the thermal derating curve provided in the datasheet. As a general guideline, for every 10°C increase in ambient temperature above 30°C, the maximum output current should be derated by 10%.
  • To troubleshoot output voltage errors or deviations, check the input voltage, output load, and ambient temperature. Ensure the input voltage is within the recommended range, the output load is within the specified current rating, and the ambient temperature is within the recommended operating range. Also, verify the output voltage sense lines are properly connected and not noisy.
  • To minimize EMI, Vicor recommends using a shielded enclosure, EMI filters, and a common-mode choke on the input lines. Additionally, a Faraday shield or a metal can be used to enclose the module. The PCB layout should also be designed to minimize noise and radiation.

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