A thermal pad on the bottom of the device should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
Use a soldering iron with a temperature range of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads and use a reflow oven or a hot air gun to solder the device.
The maximum allowable voltage stress is 1.5 times the rated voltage (125V) for a maximum of 100ms. Exceeding this may cause permanent damage to the device.
Yes, the PLP2-125 is suitable for high-frequency applications up to 100 kHz. However, ensure that the PCB layout and component selection are optimized for high-frequency operation to minimize losses and EMI.
Use an ESD wrist strap or mat, and ensure that the workspace and tools are grounded. Handle the device by the body or pins, avoiding direct contact with the die.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
PLP2-125 Overview
Use the download button to access the PLP2-125 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like PLP2-,
or try a keyword search, such as Optoelectronic Accessories
