Bivar recommends a thermal pad on the bottom of the device, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
Use a wire bondable gold wire with a diameter of 0.7-1.0 mil (18-25 μm). The bonding temperature should be between 150°C to 200°C, and the bonding force should be around 20-40 grams.
The PM3BWD can withstand a maximum voltage stress of 1.5 times the rated voltage for a duration of 1 second, but it's recommended to operate within the specified voltage range to ensure reliability.
Use ESD-safe materials and equipment, and ensure that all personnel handling the device are grounded. The device should be stored in an ESD-safe package, and it's recommended to use a wrist strap or mat during assembly.
Bivar recommends a reflow soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 1-3°C/second.
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