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PM5022-471M-RC - Bourns

Description: Fixed Inductors 470uH 20%

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PM5022-471M-RC - Bourns PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - PM5022-471M-RC
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PM5022-471M-RC - Bourns  - 3D model - Inductors Precision Moulded - PM5022-471M-RC
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PM5022-471M-RC Details

  • Manufacturer Part Number:

    PM5022-471M-RC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6.1

  • Case/Size Code:

    7255

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.82 Ω

  • Inductance-Nom (L):

    470 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e2

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    6.6 mm

  • Package Length:

    18.3 mm

  • Package Style:

    SMT

  • Package Width:

    14 mm

  • Packing Method:

    TR, Embossed , 13 Inch

  • Rated Current-Max:

    0.8 A

  • Self Resonance Frequency:

    3 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    COPPER NICKEL TIN

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

PM5022-471M-RC Frequently Asked Questions (FAQs)

  • Bourns provides a recommended PCB layout and land pattern in their application notes and design guides. It's essential to follow these guidelines to ensure optimal performance, minimal signal loss, and reduced electromagnetic interference (EMI).
  • To minimize the impact of SRF, ensure the inductor is used below its SRF, and consider adding a decoupling capacitor to filter out high-frequency noise. Additionally, use a shielded inductor or add a shield to the PCB to reduce EMI.
  • While the datasheet specifies a temperature range, it's essential to consider the derating curves for inductance and current handling at higher temperatures. Consult Bourns' application notes for guidance on temperature derating.
  • Consider factors such as inductance value, current rating, DC resistance, and physical size. Evaluate the inductor's performance in your specific circuit using simulation tools or prototyping before finalizing your design.
  • Yes, at high frequencies, the inductor's parasitic capacitance and core losses become more significant. Consider using a high-frequency optimized inductor design, and consult Bourns' application notes for guidance on high-frequency applications.

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