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PM8834MTR - STMicroelectronics

Description: STMICROELECTRONICS - PM8834MTR - MOSFET Driver, Low Side, 5V-18V Supply, 4A Out, MSOP-8

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PM8834MTR - STMicroelectronics - PCB symbol
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PCB Footprints
PM8834MTR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - MSOP 8L-EP_1
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PM8834MTR - STMicroelectronics - 3D model - Small Outline Packages - MSOP 8L-EP_1
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PM8834MTR Details

  • Manufacturer Part Number:

    PM8834MTR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    25 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • High Side Driver:

    NO

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-G8

  • Length:

    3 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    10 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    0.06 µs

  • Turn-on Time:

    0.055 µs

  • Width:

    3 mm

PM8834MTR Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a 2-layer or 4-layer PCB with a solid ground plane and a thermal relief pattern under the device to ensure optimal thermal performance. A minimum of 2 oz copper thickness is recommended for the PCB.
  • The PM8834MTR can be configured using the SPI interface. STMicroelectronics provides a configuration tool and a user manual that guides you through the configuration process. Additionally, you can refer to the application notes and design guides provided by STMicroelectronics for specific use cases.
  • STMicroelectronics recommends using 100nF to 1uF decoupling capacitors with a voltage rating of 10V or higher, placed as close as possible to the device's power pins. The capacitors should be rated for high-frequency operation and have a low ESR.
  • STMicroelectronics provides a troubleshooting guide and a FAQ document that covers common issues and their solutions. Additionally, you can use the device's built-in diagnostic features, such as the fault detection and reporting mechanism, to identify and troubleshoot issues.
  • The PM8834MTR has a maximum junction temperature of 150°C. To ensure reliable operation, the device should be mounted on a heat sink or a thermal interface material, and the PCB should be designed to dissipate heat efficiently. STMicroelectronics provides thermal design guidelines and thermal models to aid in the design process.

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PM8834MTR Overview

Use the download button to access the PM8834MTR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like PM883, or try a keyword search, such as MOSFET Drivers

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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