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PMBD6050,215 - Nexperia

Description: PMBD6050 - High-speed diode@en-us

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PCB Footprints
PMBD6050,215 - Nexperia PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT -23
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3D Models
PMBD6050,215 - Nexperia  - 3D model - SOT23 (3-Pin) - SOT -23
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PMBD6050,215 Details

  • Manufacturer Part Number:

    PMBD6050,215

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-236

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    1991-04-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.1

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.25 V

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    4 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.215 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    85 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Recovery Time-Max:

    0.004 µs

  • Reverse Test Voltage:

    50 V

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMBD6050,215 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a large copper area for heat dissipation, and minimizing thermal resistance. A 2-3 layer PCB with a solid ground plane is recommended.
  • To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended derating guidelines for the device. Also, consider using a thermal interface material with a high thermal conductivity.
  • Handle the device by the body, avoid touching the pins, and store it in an electrostatic discharge (ESD) protective package. Avoid bending or flexing the leads, and store the device in a cool, dry place away from direct sunlight.
  • Check for proper heat sinking, ensure good thermal contact between the device and the heat sink, and verify that the device is not operating above the maximum junction temperature. Also, check for any signs of physical damage or electrical overstress.
  • The recommended soldering conditions for PMBD6050,215 are: peak temperature 260°C, soldering time 10 seconds, and a soldering iron temperature of 350°C. Use a solder with a melting point above 217°C.

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PMBD6050,215 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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Part Image PMBD6050 NXP Semiconductors

Rectifier Diode, 1 Phase, 1 Element, 0.215A, 85V V(RRM), Silicon, TO-236AB

Part Image PMBD6050T/R NXP Semiconductors

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Part Image PMBD6050212 NXP Semiconductors

Rectifier Diode, 1 Phase, 1 Element, 0.215A, 85V V(RRM), Silicon

For a full list of alternate parts for PMBD6050,215, check out Findchips.com