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PMBF170,235 - Nexperia

Description: MOSFET N-channel TrenchMOS intermed level FET

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PCB Footprints
PMBF170,235 - Nexperia PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT 23 (TO-236AB)-1
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3D Models
PMBF170,235 - Nexperia  - 3D model - SOT23 (3-Pin) - SOT 23 (TO-236AB)-1
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PMBF170,235 Details

  • Manufacturer Part Number:

    PMBF170,235

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    TO-236

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    3

  • Additional Feature:

    LOGIC LEVEL COMPATIBLE

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    0.3 A

  • Drain-source On Resistance-Max:

    5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    10 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PMBF170,235 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the PMBF170,235 near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Additionally, keeping the thermal path short and using thermal vias can help to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for the PMBF170,235. This involves reducing the power dissipation as the temperature increases. Additionally, ensuring good thermal design, using a heat sink if necessary, and selecting components with high temperature ratings can help to ensure reliable operation.
  • Exceeding the maximum junction temperature (Tj) of 150°C can lead to a reduction in the device's lifespan, increased thermal resistance, and potentially even device failure. It's essential to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • The power dissipation of the PMBF170,235 can be calculated using the formula: Pd = (Vin - Vout) x Iout. Where Vin is the input voltage, Vout is the output voltage, and Iout is the output current. It's essential to consider the device's thermal characteristics and ensure that the power dissipation is within the recommended limits.
  • The PMBF170,235 has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding straps, and wrist straps to prevent damage from electrostatic discharge.

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PMBF170,235 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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