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PMBFJ177,215 - NXP

Description: JFET JFET P-CH 30V 0.8mA

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PMBFJ177,215 - NXP - PCB symbol
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PCB Footprints
PMBFJ177,215 - NXP PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - 3 lead sot-23
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3D Models
PMBFJ177,215 - NXP - 3D model - SOT23 (3-Pin) - 3 lead sot-23
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PMBFJ177,215 Details

  • Manufacturer Part Number:

    PMBFJ177,215

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-236

  • Package Description:

    PLASTIC, SMD, SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00

  • Date Of Intro:

    1993-03-01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain-source On Resistance-Max:

    300 Ω

  • FET Technology:

    JUNCTION

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.3 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PMBFJ177,215 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Focus on the input filter design, ensuring a common-mode choke with a high impedance at the switching frequency, and a differential-mode filter with a low impedance at the switching frequency. Also, consider the PCB layout and component placement.
  • Consult the application notes and reference designs provided by NXP Semiconductors. Perform thorough simulations and testing to fine-tune the design, and consider consulting with an experienced engineer or NXP's support team.
  • Implement a shielded enclosure, ensure proper grounding and bonding, and use EMI filters and shielding components. Follow the guidelines outlined in the IEC 61000-4-x series and the EN 55022 standard.

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PMBFJ177,215 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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