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PMBS3904,215 - Nexperia

Description: PMBS3904 - 40 V, 100 mA NPN general purpose transistor@en-us

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PCB Footprints
PMBS3904,215 - Nexperia PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT -23
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3D Models
PMBS3904,215 - Nexperia  - 3D model - SOT23 (3-Pin) - SOT -23
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PMBS3904,215 Details

  • Manufacturer Part Number:

    PMBS3904,215

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-236

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    1997-09-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    40 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    30

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    180 MHz

  • Turn-off Time-Max (toff):

    1200 ns

  • Turn-on Time-Max (ton):

    110 ns

PMBS3904,215 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a large copper area for heat dissipation, and minimizing thermal resistance. A 2-3 layer PCB with a solid ground plane is recommended.
  • To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended derating curves for the device. Also, consider using a thermal protection circuit to prevent overheating.
  • Handle the device by the body, not the leads, to prevent damage. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and follow ESD precautions during handling and assembly.
  • Use a systematic approach to troubleshoot issues, checking for proper power supply, input signals, and output loads. Use oscilloscopes and logic analyzers to analyze waveforms and signal integrity. Consult the datasheet and application notes for guidance.
  • Follow the recommended soldering profile and temperature limits to prevent damage. Use a soldering iron with a temperature-controlled tip, and avoid applying excessive force or pressure during assembly.

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PMBS3904,215 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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