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PMDPB80XP,115 - Nexperia

Description: Dual MOSFET, Dual P Channel, -3.7 A, -20 V, 0.08 ohm, -4.5 V, -600 mV RoHS Compliant: Yes

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PCB Footprints
PMDPB80XP,115 - Nexperia PCB footprint - Other - Other - PMDPB80XP,115-1
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3D Models
PMDPB80XP,115 - Nexperia  - 3D model - Other - PMDPB80XP,115-1
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PMDPB80XP,115 Details

  • Manufacturer Part Number:

    PMDPB80XP,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    SOT-1118, DFN2020-6, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT1118

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    2.7 A

  • Drain-source On Resistance-Max:

    0.102 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    53 pF

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    6.25 W

  • Pulsed Drain Current-Max (IDM):

    11 A

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PMDPB80XP,115 Frequently Asked Questions (FAQs)

  • Nexperia recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow Nexperia's recommended derating guidelines for the device. Additionally, ensure proper thermal management, such as using a heat sink or thermal interface material, and avoid exceeding the maximum junction temperature (Tj) of 150°C.
  • Although the datasheet specifies a maximum input voltage of 80V, it's essential to note that the device can tolerate voltage transients up to 100V for a short duration (typically <100ns). However, it's recommended to limit the input voltage to 80V or less to ensure reliable operation and prevent damage to the device.
  • To protect the PMDPB80XP,115 from ESD, follow standard ESD handling precautions, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging. Additionally, ensure that the PCB design includes ESD protection components, such as TVS diodes or ESD protection arrays, to prevent damage from ESD events.
  • Nexperia recommends a soldering profile with a peak temperature of 260°C and a dwell time of 30-60 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device and ensure reliable operation.

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PMDPB80XP,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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