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PMEG050V150EPDAZ - Nexperia

Description: Schottky Diodes & Rectifiers 50V 15A low VF MEGA Schottky barrier rec

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PMEG050V150EPDAZ - Nexperia  - 3D model
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PMEG050V150EPDAZ Details

  • Manufacturer Part Number:

    PMEG050V150EPDAZ

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    DFP

  • Package Description:

    SOT-1289, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT1289

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    3

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    50 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.5 V

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    240 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1.66 W

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Rep Pk Reverse Voltage-Max:

    50 V

  • Reverse Current-Max:

    1000 µA

  • Reverse Recovery Time-Max:

    0.02 µs

  • Reverse Test Voltage:

    50 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG050V150EPDAZ Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the tab of the device, and to use thermal vias to dissipate heat to the other side of the board. Additionally, keeping the component placement and routing away from heat-sensitive components is crucial.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the time the iron is in contact with the device. Avoid applying excessive force or pressure, which can damage the device.
  • When handling the device, take precautions to prevent electrostatic discharge (ESD) by wearing an ESD strap or using an ESD mat. Avoid touching the device's pins or exposed pads, and handle the device by the body or the pins, not the leads.
  • To determine the correct input and output capacitors, consider the output voltage, output current, and switching frequency of your application. A general rule of thumb is to use a 10uF to 22uF ceramic capacitor for the input and a 10uF to 47uF ceramic capacitor for the output. However, the optimal capacitor values may vary depending on the specific requirements of your application.
  • The PMEG050V150EPDAZ has a thermal resistance of 3.5°C/W. To ensure reliable operation, keep the device's junction temperature below 150°C. Use a thermal interface material (TIM) to improve heat transfer between the device and the heat sink, and ensure good airflow around the device.

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PMEG050V150EPDAZ Overview

Use the download button to access the PMEG050V150EPDAZ 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like PMEG0, or try a keyword search, such as Rectifier Diodes

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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