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PMEG1030EH,115 - Nexperia

Description: Diode 10 V 3A Surface Mount SOD-123F 10 V, 3 A ultra low V_F MEGA Schottky barrier rectifiers

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PMEG1030EH,115 - Nexperia PCB footprint - Other - Other - SOD123F_2023
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PMEG1030EH,115 - Nexperia  - 3D model - Other - SOD123F_2023
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PMEG1030EH,115 Details

  • Manufacturer Part Number:

    PMEG1030EH,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123

  • Package Description:

    SOD-123F, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD123F

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.12

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.53 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    9 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.375 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    10 V

  • Reverse Current-Max:

    3000 µA

  • Reverse Test Voltage:

    10 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG1030EH,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the thermal pad connected to the ground plane.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range (up to 150°C for PMEG1030EH,115). Use a suitable thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device. Monitor the device's junction temperature and adjust the thermal design accordingly.
  • The recommended soldering conditions for PMEG1030EH,115 are: peak temperature 260°C, time above 217°C 30s, and time above 200°C 60s. Use a soldering iron with a temperature range of 350°C to 400°C, and ensure that the device is not exposed to temperatures above 260°C for more than 10 seconds.
  • Handle the device by the body, not the leads. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and handling materials to prevent electrostatic discharge (ESD) damage. Avoid bending or flexing the leads, and ensure that the device is not subjected to mechanical stress.
  • The PMEG1030EH,115 has built-in ESD protection, but it is still recommended to follow standard ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that all equipment and tools are grounded. Avoid touching the device's leads or pins, and use anti-static packaging materials.

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PMEG1030EH,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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