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PMEG2005CT,215 - Nexperia

Description: 500 mA low VF dual MEGA Schottky barrier rectifier

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PCB Footprints
PMEG2005CT,215 - Nexperia PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT23_(TO-236AB) _2022
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3D Models
PMEG2005CT,215 - Nexperia  - 3D model - SOT23 (3-Pin) - SOT23_(TO-236AB) _2022
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PMEG2005CT,215 Details

  • Manufacturer Part Number:

    PMEG2005CT,215

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-236

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.08

  • Application:

    GENERAL PURPOSE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.39 V

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    10 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.33 W

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Rep Pk Reverse Voltage-Max:

    20 V

  • Reverse Current-Max:

    200 µA

  • Reverse Recovery Time-Max:

    0.022 µs

  • Reverse Test Voltage:

    20 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG2005CT,215 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a large copper area for heat dissipation, and minimizing thermal resistance by using thermal vias.
  • To ensure reliable operation in high-temperature environments, ensure the device is operated within the recommended temperature range, use a heat sink or thermal pad, and consider using a thermal interface material to improve heat transfer.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. It's essential to ensure the device operates within the recommended temperature range.
  • To handle ESD protection, follow proper handling and storage procedures, use ESD-protective packaging, and consider implementing ESD protection circuits or devices in the design.
  • Using a different package type or variant may affect the device's thermal performance, power handling, and overall performance. Ensure the chosen package meets the design requirements and operating conditions.

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PMEG2005CT,215 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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Part Image PMEG2005CT Nexperia

Rectifier Diode, Schottky, 1 Phase, 2 Element, 0.5A, 20V V(RRM), Silicon, TO-236AB

Part Image PMEG2005CT NXP Semiconductors

DIODE 0.5 A, 2 ELEMENT, SILICON, SIGNAL DIODE, TO-236AB, PLASTIC, SMD, 3 PIN, Signal Diode

Part Image PMEG2005CT,215 NXP Semiconductors

Rectifier Diode, Schottky, 2 Element, 0.5A, 20V V(RRM), Silicon, TO-236AB