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PMEG2010EA,115 - Nexperia

Description: Rectifier Diode Schottky 1A Automotive 2-Pin SOD-323 T/R

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PCB Footprints
PMEG2010EA,115 - Nexperia PCB footprint - Small Outline Diode - Small Outline Diode - SOD323
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PMEG2010EA,115 - Nexperia  - 3D model - Small Outline Diode - SOD323
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PMEG2010EA,115 Details

  • Manufacturer Part Number:

    PMEG2010EA,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Package Description:

    SC-76, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD323

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.55 V

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    5 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    20 V

  • Reverse Current-Max:

    50 µA

  • Reverse Test Voltage:

    15 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG2010EA,115 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat to the other side of the board. Additionally, keeping the thermal pad away from other components and ensuring good airflow around the device can also help.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the time the iron is in contact with the device. Avoid applying excessive force or pressure, which can damage the device.
  • The maximum allowed voltage on the input pins is 6V, as specified in the datasheet. Exceeding this voltage can cause damage to the device.
  • To handle ESD protection, use an ESD wrist strap or mat when handling the device, and ensure that the device is stored in an ESD-protected environment. Additionally, use ESD-protected packaging and handling procedures during transportation and storage.
  • The recommended operating temperature range for this device is -40°C to 125°C, as specified in the datasheet. Operating the device outside of this range can affect its performance and reliability.

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PMEG2010EA,115 Overview

Use the download button to access the PMEG2010EA,115 schematic symbol, PCB footprint, and 3D model.
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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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