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PMEG2010EPASX - Nexperia

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PMEG2010EPASX Details

  • Manufacturer Part Number:

    PMEG2010EPASX

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    SOT-1061D, DFN2020D-3, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT1061D

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    20 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.375 V

  • JESD-30 Code:

    S-PDSO-N3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    17 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.5 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    20 V

  • Reverse Current-Max:

    1900 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Reverse Test Voltage:

    20 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG2010EPASX Frequently Asked Questions (FAQs)

  • Nexperia recommends a PCB layout with a solid ground plane and a thermal pad connected to the ground plane to ensure optimal thermal performance. A minimum of 2oz copper thickness is recommended for the thermal pad.
  • Nexperia recommends using a soldering profile with a peak temperature of 260°C and a dwell time of 30-60 seconds. The device should be soldered using a solder with a melting point above 217°C.
  • The maximum allowed voltage on the enable pin (EN) is 6V. Exceeding this voltage may damage the device.
  • The PMEG2010EPASX is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the device's performance and consider additional thermal management measures for high-temperature applications.
  • The power dissipation of the PMEG2010EPASX can be calculated using the formula: Pd = (Vin - Vout) x Iout x Efficiency. The efficiency can be obtained from the datasheet or by consulting with Nexperia's application notes.

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PMEG2010EPASX Overview

Use the download button to access the PMEG2010EPASX 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like PMEG2, or try a keyword search, such as Rectifier Diodes

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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