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PMEG3005EH,115 - Nexperia

Description: Schottky Diodes & Rectifiers PMEG3005EH/SOD123F/SOD2

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PCB Footprints
PMEG3005EH,115 - Nexperia PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD123F
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3D Models
PMEG3005EH,115 - Nexperia  - 3D model - Small Outline Diode Flat Lead - SOD123F
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PMEG3005EH,115 Details

  • Manufacturer Part Number:

    PMEG3005EH,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123

  • Package Description:

    SOD-123F, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD123F

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.98

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.43 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    10 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.83 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    150 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG3005EH,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for PMEG3005EH,115 should include a solid ground plane, wide power traces, and a thermal relief pattern under the device. This helps to reduce thermal resistance and ensures efficient heat dissipation.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design guidelines, such as using a heat sink, ensuring good airflow, and keeping the device within its recommended operating temperature range (up to 150°C).
  • The recommended soldering conditions for PMEG3005EH,115 are: peak temperature 260°C, soldering time 10 seconds, and a soldering iron temperature of 350°C. It's also essential to follow the IPC J-STD-020 standard for reflow soldering.
  • To handle ESD protection for PMEG3005EH,115, it's recommended to follow standard ESD handling procedures, such as using an ESD wrist strap, ESD mat, or ESD bag. Additionally, ensure that the device is stored in a conductive bag or wrapped in conductive material during transportation.
  • When using PMEG3005EH,115 in a high-reliability application, it's essential to consider the device's failure rate, which is typically specified in the datasheet. Additionally, ensure that the device is operated within its recommended specifications, and consider implementing redundancy or error correction mechanisms to mitigate potential failures.

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PMEG3005EH,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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