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PMEG3010EP,115 - Nexperia

Description: Schottky Diodes & Rectifiers PMEG3010EP/SOD128/FlatPower , 320mV , 30V , 50A , 1.5mA , -55C to +150C , SOD-128/CFP5

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Symbol
PMEG3010EP,115 - Nexperia - PCB symbol
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PCB Footprints
PMEG3010EP,115 - Nexperia PCB footprint - Other - Other - SOD128_2024
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3D Models
PMEG3010EP,115 - Nexperia - 3D model - Other - SOD128_2024
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PMEG3010EP,115 Details

  • Manufacturer Part Number:

    PMEG3010EP,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Package Description:

    SOD-128, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD128

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.98

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.36 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.625 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    1500 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG3010EP,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a large copper area for heat dissipation, and minimizing thermal resistance. A 2-3 layer PCB with a solid ground plane is recommended.
  • To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
  • The PMEG3010EP,115 has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. For latch-up prevention, ensure that the device is not exposed to excessive voltage or current, and follow the recommended operating conditions.
  • Yes, the PMEG3010EP,115 is suitable for high-reliability and automotive applications. It meets the AEC-Q100 qualification standard for automotive-grade devices, and its robust design and manufacturing process ensure high reliability.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the pins or electrical connections. Use anti-static packaging and follow proper ESD handling procedures during assembly and testing.

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PMEG3010EP,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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