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PMEG3020BEP,115 - Nexperia

Description: Schottky Diodes & Rectifiers PMEG3020BEP/SOD128/FlatPower

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PCB Footprints
PMEG3020BEP,115 - Nexperia PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - CFP5 (SOD128)
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3D Models
PMEG3020BEP,115 - Nexperia  - 3D model - Small Outline Diode Flat Lead - CFP5 (SOD128)
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PMEG3020BEP,115 Details

  • Manufacturer Part Number:

    PMEG3020BEP,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Package Description:

    SOD-128, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD128

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.98

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.45 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.105 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    100 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG3020BEP,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range, and that the PCB is designed to dissipate heat efficiently. Additionally, consider using a heat sink or thermal pad to reduce the junction temperature.
  • The PMEG3020BEP,115 has built-in ESD protection, but it is still recommended to follow standard ESD handling precautions when handling the device. This includes using an ESD wrist strap or mat, and storing the device in an ESD-safe environment.
  • The PMEG3020BEP,115 is a surface-mount device and can be used in high-vibration environments, but it is recommended to follow standard vibration testing and qualification procedures to ensure the device meets the required reliability standards.
  • The recommended soldering conditions for the PMEG3020BEP,115 include a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering method that follows the IPC J-STD-020 standard.

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PMEG3020BEP,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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