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PMEG3020EP - Nexperia

Description: Diode, NXP, PMEG3020EP NXP PMEG3020EP, SMT Schottky Diode, 30V 2A, 2-Pin SOD-128

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Symbol
PMEG3020EP - Nexperia - PCB symbol
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PCB Footprints
PMEG3020EP - Nexperia PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD128
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3D Models
PMEG3020EP - Nexperia - 3D model - Small Outline Diode Flat Lead - SOD128
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PMEG3020EP Details

  • Manufacturer Part Number:

    PMEG3020EP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-128, 2 PIN

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.98

  • Application:

    HIGH POWER

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.36 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.625 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    3000 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

PMEG3020EP Frequently Asked Questions (FAQs)

  • Nexperia recommends a PCB layout with a solid ground plane and a thermal pad connected to the ground plane to ensure optimal thermal performance. A minimum of 2oz copper thickness is recommended for the thermal pad.
  • To ensure reliable operation at high temperatures, it is essential to follow proper thermal design and layout guidelines, including providing adequate heat sinking and thermal management. Additionally, ensure that the device is operated within the recommended operating temperature range and that the maximum junction temperature is not exceeded.
  • Nexperia recommends a soldering profile with a peak temperature of 260°C and a dwell time of 30-60 seconds. The device should be soldered using a lead-free soldering process.
  • The PMEG3020EP has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding personnel and equipment, and using ESD protection devices such as wrist straps and mats.
  • The recommended input capacitor value is 10uF to 22uF, and the recommended type is a low-ESR ceramic capacitor such as X5R or X7R. The input capacitor should be placed as close as possible to the VIN pin to ensure optimal performance.

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PMEG3020EP Overview

Use the download button to access the PMEG3020EP schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like PMEG3, or try a keyword search, such as Rectifier Diodes

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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