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PMEG4005AEA,115 - Nexperia

Description: PMEG4005AEA,115 NXP SMT Schottky Diode, 40V 500mA, 2-Pin SOD-323

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PMEG4005AEA,115 - Nexperia - PCB symbol
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PCB Footprints
PMEG4005AEA,115 - Nexperia PCB footprint - Small Outline Diode - Small Outline Diode - SOD323
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3D Models
PMEG4005AEA,115 - Nexperia - 3D model - Small Outline Diode - SOD323
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PMEG4005AEA,115 Details

  • Manufacturer Part Number:

    PMEG4005AEA,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Package Description:

    SOD-323, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD323

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.47 V

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    10 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    100 µA

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG4005AEA,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat to the other side of the board. Additionally, keeping the components away from the thermal pad and using a thermal interface material can help to improve heat dissipation.
  • To ensure reliable operation at high temperatures, it is recommended to follow the recommended operating conditions, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, derating the device's power consumption and using a heat sink can help to reduce the junction temperature.
  • The PMEG4005AEA,115 has built-in ESD protection and latch-up prevention measures, including ESD diodes and a protected output stage. However, it is still recommended to follow proper ESD handling procedures and to use a latch-up prevention circuit if necessary.
  • Yes, the PMEG4005AEA,115 is suitable for high-reliability and automotive applications. It is AEC-Q100 qualified and has a wide operating temperature range, making it suitable for use in harsh environments.
  • To troubleshoot issues with the PMEG4005AEA,115, start by checking the input voltage, output voltage, and current consumption. Use an oscilloscope to check for any unusual waveforms or noise. Check the PCB layout and thermal design to ensure that they are correct. If the issue persists, consult the datasheet and application notes, or contact Nexperia support for further assistance.

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PMEG4005AEA,115 Overview

Use the download button to access the PMEG4005AEA,115 schematic symbol, PCB footprint, and 3D model.
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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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