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PMEG6010EP,115 - Nexperia

Description: PMEG6010EP 1 A low VF MEGA Schottky barrier rectifier

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PCB Footprints
PMEG6010EP,115 - Nexperia PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD128
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3D Models
PMEG6010EP,115 - Nexperia  - 3D model - Small Outline Diode Flat Lead - SOD128
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PMEG6010EP,115 Details

  • Manufacturer Part Number:

    PMEG6010EP,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Package Description:

    SOD-128, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD128

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.07

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.53 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.625 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    60 µA

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG6010EP,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a large copper area for heat dissipation, and minimizing thermal resistance. A 2-3 layer PCB with a solid ground plane is recommended.
  • To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended operating conditions. Also, consider using a thermal protection circuit to prevent overheating.
  • The PMEG6010EP,115 has built-in ESD protection, but additional external protection measures can be taken, such as using ESD diodes or transient voltage suppressors. For latch-up prevention, ensure that the device is operated within the recommended voltage and current ranges, and use a latch-up protection circuit if necessary.
  • To optimize the device for low-power consumption, use a low-dropout regulator, minimize the input voltage, and optimize the output voltage. Additionally, consider using power-saving modes, such as shutdown or low-power modes, when the device is not in use.
  • Recommended testing and validation procedures include functional testing, parametric testing, and environmental testing. Functional testing involves verifying the device's output voltage, current, and power consumption. Parametric testing involves measuring the device's electrical characteristics, such as input/output impedance and voltage regulation. Environmental testing involves testing the device under various temperature, humidity, and vibration conditions.

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PMEG6010EP,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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