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PMEG6020EP,115 - Nexperia

Description: Schottky Diodes & Rectifiers 2A MEGA SCHOTTKY BARRIER RECTIFIER

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PCB Footprints
PMEG6020EP,115 - Nexperia PCB footprint - Other - Other - CFP5 (SOD128)-2022
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3D Models
PMEG6020EP,115 - Nexperia  - 3D model - Other - CFP5 (SOD128)-2022
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PMEG6020EP,115 Details

  • Manufacturer Part Number:

    PMEG6020EP,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Package Description:

    SOD-128, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD128

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.07

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.53 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.625 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    150 µA

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PMEG6020EP,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a solid ground plane, and minimizing the distance between the device and the thermal pad or heat sink.
  • To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Additionally, consider using a thermistor or thermal sensor to monitor the device temperature.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, decreased performance, and potentially even device failure. It's essential to ensure the device operates within the recommended temperature range to maintain reliability and performance.
  • To prevent ESD damage, handle the device by the body or pins, use an ESD wrist strap or mat, and ensure the workspace is ESD-protected. During assembly, use ESD-safe tools and follow proper handling procedures.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. Avoid exposing the device to extreme temperatures, humidity, or physical stress. Follow the recommended storage and handling guidelines to prevent damage and ensure device reliability.

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PMEG6020EP,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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